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Alphawave Semi Expands Collaboration With Samsung, Adds 3nm Connectivity IP

CEO, and Co-founder of Alphawave Semi
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By Neil Tyler, Editor, editor@newelectronics.co.uk

A specialist in high-speed connectivity, Alphawave Semi is expanding its ongoing collaboration with Samsung to include the 3nm process node.

Samsung Foundry platform customers will now be able to benefit from Alphawave Semi’s most advanced high performance connectivity IP and chiplet technologies, including 112 Gigabits-per-second (Gbps) Ethernet and PCI Express Gen6/CXL 3.0, interfaces to build the complex systems-on-a-chip (SoCs) needed by data-intensive applications such as generative AI and the associated infrastructure required by global data centres.

“Alphawave Semi is a key partner for Samsung Foundry, as they are the established industry leaders in high performance connectivity IP and chiplet solutions”, said Corporate EVP of Foundry IP development at Samsung Electronics Jongshin Shin. “We are very pleased to be deeply collaborating with Alphawave Semi over multiple customer designs and process generations, including 5nm and 4nm, and now 3nm.”

“Data centre connectivity is undergoing a remarkable transformation due to the rise of generative AI, ushering in an era of high performance chiplet-enabled silicon. Besides enabling the AI infrastructure, Alphawave Semi technology also enables connectivity in the data centres that house AI solutions”, said CEO, and co-founder of Alphawave Semi Tony Pialis.

Alphawave Semi’s high-performance connectivity PHY IP including 112 Gbps Ethernet and PCIe Gen6/CXL3.0, and Universal Chiplet Express (UCIe) are available in the Samsung Foundry nodes.

Alphawave Semi also offers them as fully integrated IP subsystems together with controller IP.

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