Qualcomm Revolutionizes The Future of AI And Connectivity With Groundbreaking Innovations At MWC Barcelona
By Oystein Bergmann, Bureau Chief, Scandinavia
At MWC Barcelona, Qualcomm Technologies, Inc., announced its latest on-device AI, intelligent computing, and wireless connectivity products and milestones, poised to accelerate digital transformation, drive a new wave of economic growth, and bring the convergence of AI and connectivity to new regions. Generative AI is expected to have a broad impact across industries, with estimates that it could add the equivalent of US$2.6 trillion to US$4.4 trillion in economic benefits annually.
Qualcomm® AI Hub features a new library of 75+ pre-optimized AI models for seamless deployment on devices powered by Snapdragon® and Qualcomm® platforms. Developers can seamlessly integrate these models into their applications, reducing time-to-market and unlocking the benefits of on-device AI implementations such as immediacy, reliability, privacy, personalization, and cost savings. These models are available on the Qualcomm AI Hub, Hugging Face, and GitHub. Developers will be able run the models themselves with a few lines of code on cloud-hosted devices powered by Qualcomm platforms.
Snapdragon® X80 5G Modem-RF System is the world’s most advanced 5G modem-to-antenna platform. The Snapdragon X80 architecture integrates 5G-Advanced capabilities and is the first modem with fully integrated NB-NTN satellite communications support for connectivity to non-terrestrial networks. A dedicated tensor accelerator powers AI optimization that improves throughput, quality of service (QoS), coverage, latency, spectrum efficiency, power efficiency, and mmWave beam management.
Qualcomm® FastConnect™ 7900 mobile connectivity system is the first to deliver AI-optimized performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip. Utilizing AI, FastConnect 7900 adapts to specific use cases and environments, delivering meaningful optimizations across power consumption, network latency and throughput. FastConnect 7900 integrates Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding to create a powerful suite of proximity technologies that enable secure device discovery, access, and control.
“The future of generative AI is hybrid, with on-device intelligence working together with the cloud to provide greater personalization, privacy, reliability and efficiency. Connectivity is critical to help generative AI scale and extend across the cloud, edge, and device, and AI solutions are enabling us to deliver next gen connectivity that can support this era of Generative AI,” said president and CEO, Qualcomm Incorporated Cristiano Amon. “As the company driving intelligent computing everywhere, we are enabling the ecosystem to develop and commercialize generative AI use cases, experiences, and leading products across device categories, including smartphones, next-gen PCs, XR devices, vehicles, robotics and more.”
These headlining products will be demonstrated alongside other announcements and milestones at the Qualcomm booth at MWC Barcelona (located in Hall 3, Booth 3E10, Fira Gran Via):
Cutting edge AI research demonstrations
World’s first large multimodal model (LMM) on an Android phone — a 7+ billion parameter LMM that can accept multiple types of data inputs, including text and images, and generate multi-turn conversations with an AI assistant about an image — running on an Android smartphone for the first time.
Stable Diffusion with Low Rank Adaptation (LoRA) — a technique enabling scalable and customized on-device generative AI across use cases — running on an Android smartphone.
World’s first on-device demonstration of a 7+ billion parameter LMM running on a Windows PC that can accept text and audio inputs (e.g., music, sound of traffic, etc.) and then generate multi-turn conversations about the audio.